06.176.2024 - Why 3D Visualization Holds Key to Future Chip Designs

Multi-die chips, known as three-dimensional integrated circuits, or 3D-ICs, represent a revolutionary step in semiconductor design. The chips are vertically stacked to create a compact structure that boosts performance without increasing power consumption. However, as chips become denser, they present more complex challenges in managing electromagnetic and thermal stresses. To understand and address this, advanced Read Article - View Press Release - Visit NVIDIA Corporation